Swiss PIC, the Swiss Photonics Integration Center organizes a workshop on Photonics Integration and Packaging supported by Swissphotonics and CSEM.

With the ever-increasing demand of photonic systems in existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification. The workshopaddresses these challenges and is a unique opportunity to discuss with colleagues and develop new solutions.

Cost
This workshop is free of charge

Registration compulsory
This Workshop is free of charge, but registration is required. The link is on top of the page. If you would like to register more than one participant, please fill for each an individual form.

Deadline for registration:  12 March 2024