Photonic integration is a core technology which enables a wide range of the technological disruptions that are currently transforming our society such as optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others.
All these technologies rely on photonic integration to miniaturise their components, lower their cost, improve performance, increase data speeds and lower energy consumption.
However, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification and support in these areas is crucial for the industry to live up to its enormous growth potential.
The Advanced Manufacturing Technology Transfer Center (AM-TTC) Alliance funds a series of technology centers across Switzerland. Each center specializes in a different technology and aims to support the Swiss industry in innovation in their field.
In 2022 the Swiss photonics community got together to establish a competence center to address their common challenges with micro optical integration and the new AM-TTC Swiss PIC was born. Swiss PIC is located in Park InnovAARE, next to the Paul Scherrer Institute, Villigen, Aargau, Switzerland