24 Feb 2022
10:30 – 18:30 microPark Pilatus, Industriestrasse 23, 6055 Alpnach-Dorf OW

Photonics Packaging Workshop


Precision Assembly in Photonics Packaging

During this workshop, which will be conducted as a joint event from Swissphotonics, the IEEE EPS chapter Switzerland and CSEM, we will look into precision assembly solutions from the industry and from development partners. Whether it be an active or a passive assembly of photonics components, it requires in many cases precision alignment of e.g. lasers, waveguides, detectors and lenses. Worldwide initiatives are underway to standardize assembly and integrate functionalities into photonic circuits. However, given the large diversity of materials used in photonics applications, in still many cases packaging solutions often necessitate custom hybrid packages. We are looking forward to bring topics to the discussion, like about common assembly strategies and e.g. trade-offs between active vs. passive alignment, hermetic vs. non-hermetic, etc. Participants will have the opportunity to submit requests and specific questions before the workshop.

Target public
R & D, companies (from SMEs to LMEs) and researchers generically interested to expand their view in the field of photonic packaging and seeking a networking environment to discuss solutions.

Covid rules
We apply 2g geimpft oder genesen (recovered or vaccinated) with on-site control and with mask requirement, subject to legal changes.

This workshop is free of charge

Registration compulsory
This workshop is free of charge, but registration is required. Please indicate in the comments field if you would like to attend the Lab/Showroom Tour and Lunch. If you would like to register more than one participant, please fill for each an individual form.
The workshop is limited to 100 participants.


10:15 Registrations, Welcome Coffee
10:30 Lab/Showroomtour CSEM in Groups (max. 60 participants)
11:30 Lunch
12:45 Opening & welcome
  Dr.-Ing. Stefan Mohrdiek
  Rony Jose James
  Dr. Christian Bosshard
13:15 Photonics Packaging
  Photonics Packaging Concepts Dr. Christoph Harder
  Landscape for photonics packaging services Dr.-Ing. Stefan Mohrdiek
13:45 Requirements and examples from industry
  Photonic Integrated Circuits requirements on integration and assembly Dr. Thomas Hessler
  Laser Diode Assembly - from Single Emitter VCSEL to High Power Laser Bars Dr. Stefan Weiß
  Automating in Photonics Dr. Guido Bonati
14:45 Networking Break
15:15 Solutions and approaches
  Laser induced soldering Dr. Andreas Walser
  Microtechnology assembly approaches Prof. Dr. Tobias Lamprecht
  Sub-micron assembly of photonic components Dr. Ivan-Lazar Bundalo
16:15 Discussion of topics, all presenters & moderator
16:45 Apéro