Photonics Packaging Workshop

Precision Assembly in Photonics Packaging

During this workshop, which will be conducted as a joint event from Swissphotonics, the IEEE EPS chapter Switzerland and CSEM, we will look into precision assembly solutions from the industry and from development partners. Whether it be an active or a passive assembly of photonics components, it requires in many cases precision alignment of e.g. lasers, waveguides, detectors and lenses. Worldwide initiatives are underway to standardize assembly and integrate functionalities into photonic circuits. However, given the large diversity of materials used in photonics applications, in still many cases packaging solutions often necessitate custom hybrid packages. We are looking forward to bring topics to the discussion, like about common assembly strategies and e.g. trade-offs between active vs. passive alignment, hermetic vs. non-hermetic, etc. Participants will have the opportunity to submit requests and specific questions before the workshop.

Target public
R & D, companies (from SMEs to LMEs) and researchers generically interested to expand their view in the field of photonic packaging and seeking a networking environment to discuss solutions.

Covid rules
We apply 2g geimpft oder genesen (recovered or vaccinated) with on-site control and with mask requirement, subject to legal changes.

Cost
This workshop is free of charge

Registration compulsory
This workshop is free of charge, but registration is required. Please indicate in the comments field if you would like to attend the Lab/Showroom Tour and Lunch. If you would like to register more than one participant, please fill for each an individual form.
The workshop is limited to 100 participants.