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VERSION:2.0
PRODID:https://github.com/derhansen/sf_event_mgt
METHOD:PUBLISH
BEGIN:VEVENT
UID:520-612@nano.swiss
CLASS: PUBLIC
SUMMARY:Photonics Integration and Packaging
DESCRIPTION:Swiss PIC, the Swiss Photonics Integration Center organizes a w
 orkshop on Photonics Integration and Packaging supported by Swissphotonics 
 and CSEM.  With the ever-increasing demand of photonic systems in existing 
 and future markets including optical communications, sensing, quantum compu
 ting, autonomous driving, AI, AR/VR, medical, and many others, the complexi
 ty of photonic packaging is also increasing. Common challenges for Swiss in
 dustry, especially start-ups and SMEs include assembly & packaging, testing
  and qualification. The workshop addresses these challenges and is a unique
  opportunity to discuss with colleagues and develop new solutions.\n\nCost 
 This workshop is free of charge  Registration compulsory This Workshop is f
 ree of charge, but registration is required. The link is on top of the page
 . If you would like to register more than one participant, please fill for 
 each an individual form.\n\nDeadline for registration:  12 March 2024
LOCATION:CSEM
DTSTAMP:20240205T132139Z
DTSTART:20240321T100000Z
DTEND:20240321T180000Z
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